February 24, 2025 - From February 21st to 24th, the 2025 China International New Energy Vehicle Technology, Components, and Services Exhibition (CINEVE 2025) kicked off grandly at the Beijing Capital International Exhibition Center. This exhibition, hosted by the China Equipment Management Association's New Energy Vehicle Industry Development Promotion Center, aims to showcase cutting-edge technologies and innovative achievements in the new energy vehicle industry. HIKSEMI made an impressive appearance at booth W42137 in Hall A1 with its series of onboard storage products, drawing considerable attention from the industry.

Industry Gathering: Pioneering Synergistic Pathways

On the first day of the exhibition, the third China International New Energy Vehicle Supply Chain Conference and Overseas Expansion Forum were also inaugurated. Diplomats from countries such as Finland, Mexico, and Armenia, along with leading automotive companies, supply chain enterprise leaders, and industry experts gathered together. Due to its outstanding performance in the field of onboard storage for new energy vehicles, HIKSEMI was honored with the "New Chain Award" at the conference.

The conference held special closed-door meetings on topics like smart cockpits and autonomous driving. Chen Jian, Product Director of HIKSEMI, was invited to attend and shared the company’s technological advantages and innovative practices in the field of onboard storage. As one of the early enterprises in China to focus on flash controller technology, flash firmware technology, and flash characteristic analysis capabilities, HIKSEMI has developed R&D capabilities for various industry application storage devices including enterprise-grade, automotive-grade, surveillance-grade, and consumer-grade solutions, establishing a complete quality system for automotive applications.

Integration Across Domains is Key to Future Smart Vehicle Development

Integration across multiple domains represents the future trend of intelligent vehicle development. By merging hardware, software, and data, traditional functional boundaries are being broken down, transforming vehicles from mere transportation tools into extensions of smart home terminals, offering users more efficient and intelligent mobile space experiences. With the continuous increase in camera resolution and levels of autonomous driving, the volume of data generated during vehicle operation is growing exponentially, significantly raising demands for capacity and performance of onboard storage systems.

Chen Jian believes that current independent storage units may be replaced by single high-capacity, high-performance automotive-grade SSDs. Currently, HIKSEMI is accelerating research and development in automotive-grade SSDs. Leveraging its accumulated expertise in smart security, storage systems, and high-performance SSDs, the company is better positioned to understand customer needs from the perspective of automotive storage systems, providing efficient and reliable whole-vehicle storage system solutions.

Innovative Products Meet Diverse Application Needs

At this exhibition, HIKSEMI showcased its full range of products in the field of onboard storage, covering embedded storage, solid-state drives, USB drives, memory cards, and more.

• HIKSEMI Automotive-Grade eMMC 5.1 MLC Series: Equipped with a high-error-correction-capability controller, original automotive-grade 3D MLC storage media, and proprietary firmware, this series supports wide temperature operation from -40°C to 105°C. For driving assistance database write scenarios, it provides larger EUDA capacity. For example, a 40GB eMMC can offer a combination of 4GB EUDA and 32GB UDA, ensuring 32GB remains available while adding a 4GB highly reliable partition, meeting both database deployment and general application needs. The product has passed AEC-Q100 and IATF16949 certifications, making it suitable for advanced driver-assistance systems, infotainment systems, event data recorders, video recording systems, and telematics control systems.

• Automotive Solid-State USB Drive HD200: Built with automotive-grade components, it operates in temperatures ranging from -40°C to 85°C and supports OTA online upgrades and deep customization. Already in mass production, HD200 has become a standard feature in some vehicles, enhancing the reliability of dashcam systems.

• Automotive Solid-State Drive CZS01: Offering sequential write speeds of up to 525MB/s, it supports multi-channel 2K video recording, ensuring smooth and stable data writing. With an operating temperature range of -25°C to 85°C, it easily handles year-round driving conditions.

Working Hand in Hand to Build a New Ecosystem for Intelligent Vehicles

According to statistics from the China Association of Automobile Manufacturers, in 2024, annual production and sales of new energy vehicles in China surpassed 10 million units for the first time, accounting for over 40% of total sales, demonstrating significant market vitality. HIKSEMI will continue to deepen its involvement in onboard applications, working alongside partners to jointly build a new ecosystem for the intelligent vehicle industry.